Zirconium Sputtering Target

Zirconium Sputtering Target

Zirconium sputtering targets typically come in various sizes depending on the application, equipment compatibility, and manufacturing process. The following standardized and customized size ranges are available: Circular Zirconium Targets (Mainstream Size) Diameter: 2 inches (50.8 mm) — Minimum commonly used size, suitable for small experimental equipment and precision coating systems 3 inches (76.2 mm) — Standard size in the semiconductor and optical coating industries, widely used in magnetron sputtering equipment 4 inches (101.6 mm) — Mainstream size for industrial mass production, balancing efficiency and cost 6 inches (152.4 mm) — Commonly used in high-throughput production, suitable for large-area coating needs φ200 mm – φ600 mm — Supported large-size customization options, often used in specialized fields such as solar energy and display panels. Thickness: 3 mm – 10 mm — The most common thickness range, balancing material utilization and sputtering uniformity. 12 mm – 40 mm — For high-power or long-life applications, such as research-grade or continuous production systems. Rectangular/Planar Targets Size Range: 100 mm × 30 mm — Small rectangular targets commonly used in laboratory research. 200 mm × 50 mm to 500 mm × 150 mm — Industrial-grade planar targets, suitable for large PVD equipment. Thickness: Typically 5 mm – 15 mm, adjusted according to substrate size and sputtering uniformity requirements. Customization available according to drawings, including: Irregular contours (ring, ellipse, fan-shaped) Special thicknesses (<2 mm ultra-thin targets or >50 mm thick targets) Surface treatments (glossy finish, acid-washed finish, Ra1.6μm polished)
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Description
Zirconium Sputtering Target

Product Name: Zirconium Sputtering Target

Material Grade: Zr702 (ASTM B493 Grade R60702)

Purity Grade: 99.95% (3N5) ​​Metal-based (Hf-free)

Core Applications: Advanced semiconductor packaging, optical coating, solar cell back electrode, microelectronic interconnect layer (PVD process)

Manufacturing Standards: Complies with ASTM B493/B493M-14 (Specification for Zirconium and Zirconium Alloy Forgings) and SEMI M13-1102 (General Specification for Sputtering Targets)

The theoretical density of the Zirconium Sputtering Target is 6.51 g/cm³, its density is ≥99.0%, its thermal conductivity is 22.6 W/m·K, and its coefficient of thermal expansion (20–300°C) is 5.7 × 10⁻⁶ /K. These parameters are measured values ​​for high-purity Zr702 targets in the standard annealed state, suitable for high-power DC/RF magnetron sputtering applications, and exhibit thermal stability superior to 99.9% purity materials.

Product Surface Quality and Microstructure Requirements:

Grain Size: ≤50 μm (average), measured by EBSD (Electron Backscatter Diffraction), with a standard deviation of grain size distribution ≤15 μm.

Surface Roughness (Ra): ≤0.8 μm, measured using a 3D optical profilometer (ISO 4287), free of scratches, indentations, and pits.

Cracks/Delamination: Not permitted. Measured using ultrasonic C-scan (ASTM E213), any crack >0.5 mm in length or delamination >1 mm² is rejected.

Microstructure: Uniform equiaxed α-phase structure. SEM (500× magnification), free of pores, inclusions, and segregation.

All targets are densified by hot isostatic pressing (HIP) to ensure grain boundary bonding strength ≥180 MPa, meeting the requirement of no delamination failure after ≥500 hours of continuous sputtering.

High-purity Zr702 sputtering target

 

 

Packaging and Shipping Specifications for Zirconium Sputtering Target (GHS and IEC Compliant):

Inner Packaging: Vacuum sealed (≤1×10⁻³ mbar) + filled with high-purity argon (99.999%), conforming to ASTM F2095.

Outer Packaging: Double-layered moisture-proof aluminum foil bag + EPE cushioning foam + wooden crate (ISPM-15 compliant), IEC 60068-2-78.

Moisture Protection Label: Moisture-proof + humidity indicator card (≤5% RH), conforming to IEC 60068-2-30.

MSDS/SDS: Compliant with GHS 7th Revision, containing 16 standard sections, including Zr dust explosion risks (P201, P261, P304+340), OSHA 29 CFR 1910.1200. Shipping label: UN 1399 (non-flammable solid metal) + corrosive substances.

Each box includes a desiccant packet (silica gel) and a humidity recorder. Temperature control throughout transportation: 5–30°C, relative humidity ≤40%.

FAQ

Q: Can you provide typical customer case studies of Zirconium Sputtering Target?

A: The world's top ten semiconductor manufacturers, including TSMC, Samsung Electronics, Intel, and SK Hynix, are all indirect end-users of zirconium targets. Their advanced processes (such as nodes below 5nm) widely utilize Zr702 targets for metal barrier layers, interface passivation layers, and interconnect structures, deposited using PVD equipment such as Applied Materials Endura® and Lam Research Kiyo®. Zirconium targets are thus embedded as key functional materials in their mass production processes.

Leading international display and photovoltaic companies, such as LG Display, Samsung Display, and First Solar, use high-purity zirconium targets in OLED panel electrode coating and CIGS solar cell back electrode manufacturing to achieve low-resistance, high-stability metal thin film deposition, meeting the demands of large-area, high-uniformity production.

Aerospace and defense high-end manufacturing companies, including Lockheed Martin, Boeing, and Northrop Grumman, use zirconium targets for PVD deposition of high-temperature, corrosion-resistant coatings, applied to engine components, thermal protection systems, and radar stealth structures. Their procurement standards are stringent, requiring compliance with AS9100D certification and batch COA traceability.

Q: Do you accept bank letters of credit?

A: Yes, we accept letters of credit (L/C) as a method of payment for purchases. Please stay in touch.

Q: Are Zirconium sputtering targets generally certified by ISO 9001, IATF 16949, and AS9100?

A: Yes, in the field of zirconium sputtering targets for industrial and high-end applications, ISO 9001, IATF 16949, and AS9100D certifications have become universal and mandatory entry standards.

 

 

 

 

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