High Purity Sputtering Target

Our high purity sputtering targets are the core source material for physical vapor deposition (PVD) and magnetron sputtering processes, engineered to meet the most stringent requirements of global high-tech manufacturers, research institutions, and industrial coating service providers. Manufactured in full compliance with ASTM F2113-01, the international standard for impurity analysis and grade classification of high purity metallic sputtering targets for electronic thin film applications, our product line covers a full spectrum of metallic and alloy materials—including titanium, niobium, zirconium, nickel-iron (permalloy), copper, aluminum, and refractory metal alloys—with purity grades ranging from 3N (99.9%) to 6N (99.9999%).